IEEE International Conference on Blockchain and Cryptocurrency
27–31 May 2024 // Dublin, Ireland




Workshop Theme: Building a Decentralized Future Together


Organizing Chairs:

Xinxin Fan


Lei Xu
Kent State University, USA



Technical Program Committee:


Mark Christopher Ballandies, ETH Zurich & onocoy & WiHi, Switzerland

Thusitha Dayaratne, Monash University, Australia

Uroš Kalabić, onocoy & WiHi, Switzerland

Salil Kanhere, University of New South Wales, Australia

Yuhong Liu, Santa Clara University, USA

Younghee Park, San Jose State University, USA

Gowri Sankar Ramachandran, Queensland University of Technology, Australia

Kouichi Sakurai, Kyushu University, Japan

Gokarna Sharma, Kent State University, USA

Carl Vogel, 6th Man Ventures, USA

Qin Wang, CSIRO Data61, Australia

Ronghua Xu, Michigan Technological University, USA


    Important dates:

Paper submission (EXTENDED): March 05, 2024

Review Released to Authors: March 31, 2024

Rebuttals Due: April 3, 2024

Final Acceptance Notification: April 5, 2024

Camera-ready submission: April 12, 2024











Decentralized physical infrastructure network (DePIN) is an emerging research area in Web3 and IoT domains, which leverage blockchain, IoT and tokenomics to incentivize communities to build physical infrastructure networks and machine economy from the ground up. DePINs are expected to disrupt existing IoT business models and enable developers to build machine-driven and decentralized IoT applications. A lot of research challenges need to be addressed to fully realize the ultimate vision of DePIN - giving back control of devices and data to users.


Topics of Interest:

The workshop welcomes contributions describing design challenges, methodologies, implementations, use cases, and tokenomics of building DePIN. Topics of particular interest include, but are not limited to:

  • System architectures and implementations of DePIN
  • Layer 2 solutions and cross-chain protocols for DePIN
  • Off-chain computing and blockchain oracles for DePIN
  • Experimental evaluations and performance analysis of DePIN
  • Testbeds and simulators for DePIN
  • Hardware and firmware design for DePIN
  • Device identity and management for DePIN
  • Security and privacy of DePIN
  • Disruptive and sustainable business models for DePIN
  • Tokenomics of DePIN
  • Governance protocols for DePIN
  • Use cases of DePIN in industrial and consumer environments


Paper Submission:

Authors are invited to submit original papers written in English that have not been published or submitted for publication elsewhere. Each submission should include a 75 to 200 word abstract that clearly outlines the scope and contributions of the paper, and a list of key words. There is a length limitation of 6 pages (including title, abstract, all figures, tables, and references) for regular papers, and 4 pages for short papers describing work in progress. Submissions must be in IEEE 2-column style. Papers exceeding these limits, multiple submissions, and self-plagiarized papers will be rejected without further review. All submitted papers will be peer-reviewed using a double-blind review process with a rebuttal period. The paper should be anonymized, such that all identifying information (either explicit or implied – for example, names, affiliations, acknowledge and funding sources) should be removed from the initial submission. The paper submission templates are available on IEEE Manuscript Templates for Conference Proceedings. Authors should submit their papers (full or short) in PDF to the EDAS system (   



Papers accepted for DePIN 2024 will be included in the conference Proceedings, IEEE Xplore and EI Index. The IEEE reserves the right to remove any paper from IEEE Xplore and EI Index if the paper is not presented at the conference. We plan to work with a leading journal to solicit extended version of the best workshop paper of DePIN 2024 to be submitted for a fast-track special issue.


More information on the workshop:




Technical Sponsors